MSD1260H-222

General specification Core Material: Ferrite Weight: 2.8 – 3.2 g Packaging: 500/13 reel, Plastic tape: 24 mm wide, 0.5 mm thick, 16 mm pocket spacing, 6.9 mm pocket depth Winding to Winding Isolation: 500 Vrms, one minute Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info

450,00 ₽

Артикул: MSD1260H-222MED Категорий: 1 1 Shielded Coupled, Coupled Inductors, MSD_H, MSD1260H, MSD1260H-222, Power, Products

Описание

Specifications

Electrical specifications at 25C.

For Flyback Applications

Part number 1	Inductance (H) 2 (Tolerance: &plusmn,20%)	DCR max (Ω) 3	Isolation Voltage (V)	Leakage Inductance (nH) 5	Turns Ratio
Part number 1	Inductance (H) 2 (Tolerance: &plusmn,20%)	DCR max (Ω) 3	Isolation Voltage (V)	Leakage Inductance (nH) 5	Turns Ratio
MSD1260H-222ME_	2.2	0.017	500	143	1 : 1

For SEPIC Applications

Part number 1	Inductance (H) 2 (Tolerance: &plusmn,20%)	DCR max (Ω) 3	SRF typ (MHz) 4	Coupling coefficient	Leakage Inductance (nH) 5	Isat (A) 6			Irms (A)
Part number 1	Inductance (H) 2 (Tolerance: &plusmn,20%)	DCR max (Ω) 3	SRF typ (MHz) 4	Coupling coefficient	Leakage Inductance (nH) 5	10% drop	20% drop	30% drop	both windings 7	one winding 8
MSD1260H-222ME_	2.2	0.017	57.0	0.97	143	10.1	11.8	13.0	4.5	6.3

Каталог

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MSD1260H-222

Specifications

For Flyback Applications

For SEPIC Applications

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