Клей Эпо-Тек H20E (DG)

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EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for thermal management applications due to its high thermal conductivity.

• EPO-TEK® H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
• Extremely reliable conductive adhesive choice for new and old applications
• H20E contains no solvents and will not outgas
• When cured, H20E is resistant to solvents, resin and moisture
• Long Pot life (2½ days)
• Shelf life is one year when stored at 23°C

Maximum Bond Line Cure Schedule:

• 175°C 45 seconds
• 150°C 5 minutes
• 120°C 15 minutes
• 80°C 3 hours

Typical properties:

(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results, Cure condition: 150°C/1 hour, *denotes test on lot acceptance basis)

Physical Properties

• Color: Part A: silver, Part B: silver
• Consistency: Smooth, thixotropic paste
• Viscosity (@ 100 RPM / 23°C): 2,200-3,200 cPs
• Thixotropic Index: 4.63
• Glass Transition Temp (Tg): ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min, Ramp -10 to 200°C @ 20°C/Min)
• Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10^-6 in/in/°C, Above Tg: 158 x 10^-6 in/in/°C
• Shore D hardness: 75
• Lap Shear Strength @ 23°C: 1,475 psi
• Die Shear Strength @ 23°C: >10 kg / 3,400 psi
• Degradation Temp (TGA): 425°C
• Weight Loss:
• @ 200°C: 0.59%
• @ 250°C: 1.09%
• @ 300°C: 1.67%

Operating Temp:

• Continuous: -55°C to 200°C
• Intermittent: -55°C to 300°C

Storage Modulus @ 23°C: 808,700 psi

Ions:

• Cl- 73 ppm
• Na+ 2 ppm
• NH4+ 98 ppm
• K+ 3 ppm

*Particle Size: ≤45 microns

Electrical Properties

• Volume Resistivity @ 23°C: ≤0.0004 Ohm-cm

Thermal Properties

• Thermal Conductivity: 2.5 W/mK, Based on standard method: Laser Flash 29 W/mK, Based on Thermal Resistance Data: R = L x K^-1 x A^-1
• Thermal Resistance: (Junction to Case): TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick)
• EPO-TEK®H20E: 6.7 to 7.0°C/W
• Solder: 4.0 to 5.0°C/W

Technical Data Sheet

Safety Data Sheet – Part A

Safety Data Sheet – Part B

Технические характеристики

175°C