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0805HP-121
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-151
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-18N
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-27N
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-391
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-50N
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-821
0,00 ₽General specification Core Material: Ceramic Weight: 9.5 – 12.5 mg Packaging: 2000/7 reel, 7500/13 reel. Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth Temperature coefficient of inductance: +100 to +250 ppm/°C Soldering/Washing Moisture Sensitivity Level (MSL): 1 (unlimited floor life at Resistance to soldering heat: Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Refer to Soldering Coilcraft Components before soldering. PCB Washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info
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0805HP-82N
0,00 ₽Общая спецификация Материал сердечника: Керамика Вес: 9,5 – 12,5 мг Упаковка: бобина 2000/7, бобина 7500/13. Пластиковая лента: ширина 8 мм, толщина 0,23 мм, расстояние между карманами 4 мм, глубина кармана 1,65 мм Температурный коэффициент индуктивности: от +100 до +250 ppm/°C Пайка/мойка Уровень чувствительности к влаге (MSL): 1 (неограниченный срок службы при Устойчивость к нагреву пайки: макс. три 40-секундных оплавления при температуре +260C, детали охлаждаются до комнатной температуры между циклами. Перед пайкой ознакомьтесь с разделом «Паяние компонентов Coilcraft». Промывка печатной платы: протестировано по методу MIL-STD-202 215 плюс дополнительная водная промывка. Дополнительная информация
